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0447692402 IiNkcazo zeTekhnoloji

Conn Wire to Board RCP 24 POS 3mm Solder ST Thru-Hole Micro-Fit 3.0 BMI™ Tray

Uphawu lweMveliso Ixabiso lophawu
Category Izixhobo / IC and Component Sockets
Manufacturer Molex
Factory Lead Time 3 Weeks
Factory Lead Time 9 Weeks
Mounting Type Through Hole
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Packaging Tray
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Receptacle
Applications General Purpose, Telecommunications
Voltage - Rated 250VAC
Contact Finish - Mating Gold
DIN Conformance NO
Filter Feature NO
Mixed Contacts NO
Terminal Pitch 3mm
Style Board to Board or Cable
Pitch - Mating 0.118 3.00mm
Row Spacing - Mating 0.118 (3.00mm)
Contact Finish - Post Tin
Contact Finish Thickness - Mating 15.0μin 0.38μm
Stack Height (Mating) 16.86mm
RoHS Status ROHS3 Compliant
Uphawu lweMveliso Ixabiso lophawu
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Contact Material Phosphor Bronze
Contact Shape Square
Operating Temperature -40°C~105°C
Series Micro-Fit 3.0 BMI 44769
Feature Board Guide
Part Status Active
Termination Solder
Number of Positions 24
Number of Rows 2
Fastening Type Push-Pull
MIL Conformance NO
IEC Conformance NO
Contact Type Female Socket
Current Rating (Amps) 5A
Insulation Height 0.535 13.60mm
Number of Positions Loaded All
Insulation Color Black
Contact Length - Post 0.134 3.40mm
UL Flammability Code 94V-0
Contact Finish Thickness - Post 100.0μin 2.54μm
Material Flammability Rating UL94 V-0
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Ezi nxalenye zilandelayo ziquka  '04476' 

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