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HEP.3F.330.XLNP IiNkcazo zeTekhnoloji

CONN RCPT FMALE 30POS GOLD SLDR

Uphawu lweMveliso Ixabiso lophawu
Category Izihlanganisi, Ukudibanisa / Izihlanganisi Ezimile
Manufacturer LEMO
Factory Lead Time 3 Weeks
Voltage Rating -
Shielding Shielded
Shell Size - Insert 330
Shell Finish Nickel
Packaging Bulk
Operating Temperature -15°C ~ 100°C
Mounting Type Panel Mount, Through Hole
Material Flammability Rating UL94 V-0
Insert Material Polyetheretherketone (PEEK)
Features Potted
Detailed Description 30 Position Circular Connector Receptacle, Female Sockets Solder Gold
Contact Material Bronze
Contact Finish - Mating Gold
Color Gray
Backshell Material, Plating -
Uphawu lweMveliso Ixabiso lophawu
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Termination Solder
Shell Size, MIL -
Shell Material Aluminum Alloy
Series 3F
Orientation P
Number of Positions 30
Mounting Feature Bulkhead - Front Side Nut
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Ingress Protection IP68 - Dust Tight, Waterproof
Fastening Type Push-Pull
Current Rating 3.5A
Contact Finish Thickness - Mating 59.0µin (1.50µm)
Connector Type Receptacle, Female Sockets
Cable Opening -
Applications Aerospace
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Ezinye ziquka   "HEP.3"   iinxalenye

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HEP.3F.330.XLNP abavelisi beempawu: LEMO, Bonchip isitokhwe, HEP.3F.330.XLNP ixabiso reference. HEP.3F.330.XLNP iiparamitha, HEP.3F.330.XLNP I-Datasheet PDF kunye ne-pin diagram inkcazo yokukhuphela.Ungasebenzisa i HEP.3F.330.XLNP Iziqhagamshelo eziPluggable, DSP Datesheet PDF, fumana HEP.3F.330.XLNP Umzobo wephini kunye nomzobo wesekethe kunye nendlela yokusetyenziswa komsebenzi, HEP.3F.330.XLNP electronics tutorials.Ungakhuphela kwi Bonchip.
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