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BR25G512FJ-3GE2 IiNkcazo zeTekhnoloji

SPI BUS EEPROM

Uphawu lweMveliso Ixabiso lophawu
Category Iisekethe ezihlanganisiweyo (ICs) / Umbane
Manufacturer LAPIS Semiconductor
Factory Lead Time 3 Weeks
Write Cycle Time - Word, Page 5ms
Technology EEPROM
Packaging Tape & Reel (TR)
Other Names BR25G512FJ-3GE2TR
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Interface SPI
Manufacturer Standard Lead Time 9 Weeks
Detailed Description EEPROM Memory IC 512Kb (64K x 8) SPI 10MHz 8-SOP-J
Uphawu lweMveliso Ixabiso lophawu
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Voltage - Supply 1.8 V ~ 5.5 V
Supplier Device Package 8-SOP-J
Package / Case 8-SOIC (0.154", 3.90mm Width)
Operating Temperature -40°C ~ 85°C (TA)
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Memory Size 512Kb (64K x 8)
Memory Format EEPROM
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Clock Frequency 10MHz
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BR25G512FJ-3GE2 abavelisi beempawu: LAPIS Semiconductor, Bonchip isitokhwe, BR25G512FJ-3GE2 ixabiso reference. BR25G512FJ-3GE2 iiparamitha, BR25G512FJ-3GE2 I-Datasheet PDF kunye ne-pin diagram inkcazo yokukhuphela.Ungasebenzisa i BR25G512FJ-3GE2 Iziqhagamshelo eziPluggable, DSP Datesheet PDF, fumana BR25G512FJ-3GE2 Umzobo wephini kunye nomzobo wesekethe kunye nendlela yokusetyenziswa komsebenzi, BR25G512FJ-3GE2 electronics tutorials.Ungakhuphela kwi Bonchip.
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