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HSE-B18317-035H IiNkcazo zeTekhnoloji

HEAT SINK, EXTRUSION, TO-218, 31

Uphawu lweMveliso Ixabiso lophawu
Category Thermal Management / Heat Sinks
Manufacturer CUI Devices
Factory Lead Time 3 Weeks
Factory Lead Time 11 Weeks
Shape Rectangular, Fins
Material Finish Black Anodized
Part Status Active
Type Board Level, Vertical
Height Off Base (Height of Fin) 0.984 25.00mm
Thermal Resistance @ Natural 7.65°C/W
Length 1.250 31.75mm
RoHS Status RoHS Compliant
Uphawu lweMveliso Ixabiso lophawu
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Material Aluminum Alloy
Package Cooled TO-218
Series HSE
Moisture Sensitivity Level (MSL) Not Applicable
Attachment Method PC Pin
Thermal Resistance @ Forced Air Flow 3.63°C/W @ 200 LFM
Power Dissipation @ Temperature Rise 9.8W @ 75°C
Width 1.638 41.60mm
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Ezinye ziquka   "HSE-B"   iinxalenye

Ezi nxalenye zilandelayo ziquka  'HSE-B' 

Inxalenye # Umenzi Udidi Ubukho
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HSE-B1711-032 CUI Devices Heat Sinks
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HSE-B18254-0396H CUI Devices Heat Sinks

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HSE-B18317-035H abavelisi beempawu: CUI Devices, Bonchip isitokhwe, HSE-B18317-035H ixabiso reference. HSE-B18317-035H iiparamitha, HSE-B18317-035H I-Datasheet PDF kunye ne-pin diagram inkcazo yokukhuphela.Ungasebenzisa i HSE-B18317-035H Iziqhagamshelo eziPluggable, DSP Datesheet PDF, fumana HSE-B18317-035H Umzobo wephini kunye nomzobo wesekethe kunye nendlela yokusetyenziswa komsebenzi, HSE-B18317-035H electronics tutorials.Ungakhuphela kwi Bonchip.
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