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BDN13-3CB/A01 IiNkcazo zeTekhnoloji

HEATSINK CPU W/ADHESIVE 1.31"SQ

Uphawu lweMveliso Ixabiso lophawu
Category Abalandeli, Ulawulo lweThermal / Thermal - Iinkomishi
Manufacturer CTS Electronic Components
Factory Lead Time 3 Weeks
Width 1.310" (33.27mm)
Thermal Resistance @ Natural 16.10°C/W
Shape Square, Pin Fins
Power Dissipation @ Temperature Rise -
Other Names 294-1100 BDN133CB/A01 BDN133CBA01 BDN143CBA01
Material Finish Black Anodized
Manufacturer Standard Lead Time 14 Weeks
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Diameter -
Attachment Method Thermal Tape, Adhesive (Included)
Uphawu lweMveliso Ixabiso lophawu
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Type Top Mount
Thermal Resistance @ Forced Air Flow 6.00°C/W @ 400 LFM
Series BDN
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Aluminum
Length 1.310" (33.27mm)
Height Off Base (Height of Fin) 0.355" (9.02mm)
Detailed Description Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
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Ezinye ziquka   "BDN13"   iinxalenye

Ezi nxalenye zilandelayo ziquka  'BDN13' 

Inxalenye # Umenzi Udidi Ubukho
BDN13-3CB/A01 CTS Thermal Management Products Heat Sinks

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BDN13-3CB/A01 abavelisi beempawu: CTS Electronic Components, Bonchip isitokhwe, BDN13-3CB/A01 ixabiso reference. BDN13-3CB/A01 iiparamitha, BDN13-3CB/A01 I-Datasheet PDF kunye ne-pin diagram inkcazo yokukhuphela.Ungasebenzisa i BDN13-3CB/A01 Iziqhagamshelo eziPluggable, DSP Datesheet PDF, fumana BDN13-3CB/A01 Umzobo wephini kunye nomzobo wesekethe kunye nendlela yokusetyenziswa komsebenzi, BDN13-3CB/A01 electronics tutorials.Ungakhuphela kwi Bonchip.
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