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HS09 IiNkcazo zeTekhnoloji

HEATSINK TO3

Uphawu lweMveliso Ixabiso lophawu
Category Abalandeli, Ulawulo lweThermal / Thermal - Iinkomishi
Manufacturer Apex Microtechnology
Factory Lead Time 3 Weeks
Width 1.290" (32.77mm)
Thermal Resistance @ Natural 11.70°C/W
Shape Rhombus
Power Dissipation @ Temperature Rise 7.0W @ 80°C
Other Names 598-1371 598-2030 598-2030-ND
Material Finish Black Anodized
Manufacturer Standard Lead Time 12 Weeks
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Diameter -
Attachment Method Bolt On
Uphawu lweMveliso Ixabiso lophawu
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Type Board Level
Thermal Resistance @ Forced Air Flow 14.00°C/W @ 200 LFM
Series Apex Precision Power®
Package Cooled TO-3
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Material Aluminum
Length 1.630" (41.40mm)
Height Off Base (Height of Fin) 0.750" (19.05mm)
Detailed Description Heat Sink TO-3 Aluminum 7.0W @ 80°C Board Level
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Ixabiso lokuthumela ngenqanawe Ireyithi yokuthumela isekelwe kubungakanani, ubunzima, indawo yokuya kuyo iphakheji. I-Bonchip inikezela ngeendlela zokuthumela ezikhuphisanayo ngokusebenzisa abathwali abaphezulu be-DHL, i-FedEx kunye ne-UPS. Sikwabonelela ngeenkonzo zeakhawunti yokuthumela kubathengi abanqwenela ukuhlawulwa ngokuthe ngqo ngokuthumela.
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Intlawulo TT kwangaphambili (ukudluliselwa kwebhanki), iWestern Union, ikhadi letyala, iPayPal. UmThengi unoxanduva lokuhlawula iinqanawa, iintlawulo zebhanki, imisebenzi kunye neerhafu.
HS09 abavelisi beempawu: Apex Microtechnology, Bonchip isitokhwe, HS09 ixabiso reference. HS09 iiparamitha, HS09 I-Datasheet PDF kunye ne-pin diagram inkcazo yokukhuphela.Ungasebenzisa i HS09 Iziqhagamshelo eziPluggable, DSP Datesheet PDF, fumana HS09 Umzobo wephini kunye nomzobo wesekethe kunye nendlela yokusetyenziswa komsebenzi, HS09 electronics tutorials.Ungakhuphela kwi Bonchip.
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